Insight SIP

This ultra-small LGA module, 8 x 8 x 1 mm, is based on the nRF52832 Chip. Its powerful Cortex™ M4 CPU, flash and RAM memory combined with an optimized antenna offers the perfect solution for Bluetooth connectivity. The solution is best in class for RF performance and low power consumption. Multiple digital and analogue interfaces give optimum flexibility for sensor integration.

QFN20 4mm x 4mm PLASTIC QUAD FLATPACK NO_LEAD (C2500)

Quectel

Embedded WiFi Module

Winbond

Ultra Fine Pitch Ball Grid Array

FTDI

USB IC from FTDI used in module UM232H, QFN-48 8x8x9mm

Non fourni(e)

Non fourni(e)

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Standard resistor/capacitor 3220 chip SMD package

DSC1123CI2 Low-Jitter Precision LVDS Oscillator DSC1103 DSC1123

DSC1103 DSC1123 MicrelPackage for LVDS Oscillator DSC1123. DFN-6, 6 pin package. Package size 3.2mm x 2.5mm.http://ww1.microchip.com/downloads/en/DeviceDoc/DSC1103%20DSC1123%20Datasheet%20MKQBPD11041003-6.pdf

ON Semiconductor

Package for ON Semiconductor ESD7008 ESD Protection diodes. UDFN-18, body size 5.5x1.5mm.http://www.onsemi.com/pub_link/Collateral/ESD7008-D.PDF